SMT MANUFACTURING FACILITY

We offer a flexible, high technology, high mix environment, made up of:

• SMT Line capable of handling printed circuit boards (PCB) up to 510mm x 410mm
• The Yamaha YCP10, a fully automatic screen printer with 2D paste inspection
• The Yamaha YSI-SP 3D high-speed solder paste inspection machine
• An I-Pulse M7 High Speed Chip Shooter, handling components from 01005 to 24mm squared
• An I-Pulse M10 Placement machine capable of board warp detection and fully controllable placement force, with a component range of 01005 up to 120mm x 90mm x 30mm and a high feeder capacity of up to 90mm x 8mm feeders
• An I-Pulse M2 Flexible Placement machine with 40 Matrix tray capacity, stick feeders handling components from 01005 to 120mm x 90mm, including BGA, uBGA, QFN and QFP
• An Electovert Omniflex 10 Reflow Oven, with 10 heating zones and 2 cooling zones that allow for optimal profile control.

Our 3D AOI inspection capabilities, facilitated by the Yamaha YSI-V, include:

Passive chip components:

• Component location and orientation
• Component values
• Solder fillets of individual terminations

Discretes, ICs and Connectors

• Component location and orientation
• Component values
• Solder fillets of individual terminations
• Lead spacing inspection
• Solder bridge inspection

Additionally, we offer the placement and rework of BGA, uBGA, QFP, CSP and connectors using an Ersa IR/PL650A Precision Placement System.

Enviro facility

Test facility equipment including vibration chambers and bump testing.

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ANECHOIC CHAMBER

HBL has in-house anechoic testing facilities ranging from small to medium chambers.

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