We offer a flexible, high technology, high mix environment:

  • SMT Line capable of handling pcbs up to 510mm x 410mm
  • MPM AccuFlex screen printer with fiducial alignment and paste on pad inspection
  • I-Pulse M7 High Speed Chip Shooter handling components from 01005 to 24 mm square
  • I-Pulse M2 Flexible placement machine with 40 Matrix tray capacity, stick feeders handling components from 01005 to 120mm x 90mm including BGA, uBGA, QFN and QFP
  • Electovert Omniflex 10 Reflow Oven, the 10 heating zones and 2 cooling zones allow for optimal profile control.

AOI Inspection consisting of Omron VT-RNS which is capable of inspecting:

Passive chip components:

  • Component location and orientation
  • Component values
  • Solder fillets of individual terminations

Discretes, ICs and Connectors

  • Component location and orientation
  • Component values
  • Solder fillets of individual terminations
  • Lead spacing inspection
  • Solder bridge inspection

Placement and rework of BGA, uBGA, QFP, CSP and connectors using an Ersa IR/PL650A Precision Placement System.



Enviro facility

Test facility equipment including vibration chambers and bump testing.

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HBL has in-house anechoic testing facilities ranging from small to medium chambers.

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Latest news

Hosiden Besson now offers precise automated CMM measuring

UK manufacturer Hosiden Besson has invested in an automated coordinate measuring machine for incredibly efficient measurements of objects.

CMM precise measuring machine

Hosiden Besson joins BSIF

Hosiden Besson has shown its commitment to producing high quality safety products with its recent membership of the British Industry Safety Federation (BSIF).

Companies need to listen to hearing loss warnings

According to the UK Government’s Health and Safety Executive (HSE), industrial hearing loss accounts for nearly 75% of all occupational disease civil claims

Aurelo hearing protection

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